StarTech.com 20g Tube CPU Thermal Paste Grease Compound for Heatsinks
- 1.066 W/m·K
- 0.195 °C/W 2.3 g/cm³
- White
The HEATGREASE20 CPU Thermal Paste Compound can be used to improve the effectiveness of a CPU cooler, by thermally bonding the surface of the CPU to the heatsink, which enables the heatsink and fan to work more efficiently to remove harmful heat from the CPU.
This 20g tube of ceramic-based thermal grease is enough for a large number of CPU installations for most home or business computers or any other light application where good thermal bonding between two surfaces is required.
Please see our support section for the Material Safety Data Sheet for HEATGREASE20.
The StarTech.com Advantage
– Improves the heat transfer between a CPU and heatsink to keep the CPU running cooler
– Effectively fills surface imperfections on CPU to prevent air pockets and help heat transfer
– Ceramic-based compound that is electrically non-conductive, for safe use around electronics
| Features | |
|---|---|
| Operating relative humidity (H-H) | 10 – 80% |
| Storage temperature (T-T) | -50 – 100 °C |
| Operating temperature (T-T) | -20 – 100 °C |
| Thermal resistance | 0.195 °C/W |
| Specific gravity | 2.3 g/cm³ |
| Product colour | White |
| Thermal conductivity | 1.066 W/m·K |
| Technical details | |
|---|---|
| Evaporation (@ 200°C/24h) | 0.001% |
| Bleed (@ 200°C/24h) | 0.005% |
| Compliance certificates | RoHS |
| Weight & dimensions | |
|---|---|
| Weight | 24 g |
| Height | 18 mm |
| Depth | 18 mm |
| Width | 72 mm |
| Packaging data | |
|---|---|
| Package weight | 37 g |
| Package height | 23 mm |
| Package depth | 152 mm |
| Package width | 84 mm |
