HP Intel Xeon Gold 6136 processor 3 GHz 24.75 MB L3
- Intel® Xeon® Gold 6136 3 GHz
- 24.75 MB L3 LGA 3647 (Socket P)
- Processor cores: 12 14 nm 64-bit 150 W
- Maximum internal memory supported by processor: 768 GB DDR4-SDRAM
Options, accessories, services and support for all your HP and Compaq products.
| Processor | |
|---|---|
| Processor codename | Skylake |
| Stepping | H0 |
| Thermal Design Power (TDP) | 150 W |
| Processor cache type | L3 |
| Processor cache | 24.75 MB |
| Processor boost frequency | 3.7 GHz |
| Processor operating modes | 64-bit |
| Processor threads | 24 |
| Processor series | Intel Xeon Gold 6000 Series |
| Component for | Server/workstation |
| Cooler included | No |
| Processor lithography | 14 nm |
| Processor socket | LGA 3647 (Socket P) |
| Processor cores | 12 |
| Processor base frequency | 3 GHz |
| Processor model | 6136 |
| Processor generation | 1st Generation Intel® Xeon® Scalable |
| Processor family | Intel® Xeon® Gold |
| Memory | |
|---|---|
| ECC | Yes |
| Memory channels | Hexa-channel |
| Memory clock speeds supported by processor | 2666 MHz |
| Memory types supported by processor | DDR4-SDRAM |
| Maximum internal memory supported by processor | 768 GB |
| Graphics | |
|---|---|
| On-board graphics card | No |
| Features | |
|---|---|
| HP segment | Business |
| Scalability | S4S |
| Embedded options available | No |
| Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
| PCI Express slots version | 3.0 |
| Maximum number of PCI Express lanes | 48 |
| Market segment | Server |
| Execute Disable Bit | Yes |
| Processor special features | |
|---|---|
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel 64 | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel TSX-NI | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Optane™ Memory Ready | No |
| Intel® vPro™ Platform Eligibility | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel Trusted Execution Technology | Yes |
| Intel® Speed Shift Technology | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Operational conditions | |
|---|---|
| Tcase | 85 °C |
| Packaging data | |
|---|---|
| Package height | 156 mm |
| Package depth | 203 mm |
| Package width | 399 mm |
| Other features | |
|---|---|
| Compatibility | Z8G4 |
